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High-density packaging technology - List of Manufacturers, Suppliers, Companies and Products

High-density packaging technology Product List

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"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

"Achieving the world's smallest level 25um crimp diameter bump" - Compact and high-density mounting technology

Challenging the limits of ultra-small diameter bumps! Achieving the world's smallest level 25um crimp diameter bump with compact, high-density mounting technology!

Hakodate Electronics Co., Ltd. is engaged in the development of fine-pitch gold stud bump processing technology and the development of mounting structures utilizing gold stud bumps through prototype development. By advancing the technology for miniaturization and fine-pitching of Au stud bumps, we achieve the world's smallest level of 25μm bonding diameter bumps. 【Bump Diameter Comparison】 ■ Bump Bonding Diameter (Bump Pitch) - 88μm (90μm) - 61μm (70μm) - 51μm (60μm) - 40μm (50μm) - 25μm (28μm) *For more details, please feel free to contact us.

  • Other mounting machines

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High-density packaging technology "FCB & COF"

High-density packaging technology "FCB & COF"

It is possible to further reduce the implementation area compared to the WB method, enabling miniaturization on printed circuit boards.

"FCB&COF (Flip Chip Bonding) & COF (Chip on FPC)" is a method that forms bumps on the electrode part of a semiconductor chip and connects it by placing it directly on the electrodes of a printed circuit board (face down) while applying heat. It is also possible to implement it in combination with SMT, enabling miniaturization of the module. 【Features】 ■ Miniaturization on printed circuit boards is possible ■ Implementation in combination with SMT is also possible ■ Miniaturization of the module is possible *For more details, please download the PDF or feel free to contact us.

  • Processing Contract
  • Printed Circuit Board
  • Contract manufacturing

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Contributing to miniaturization with high-density packaging.

Contributing to miniaturization with high-density packaging.

We achieve narrow GAP implementation and miniaturization of high-quality implementation boards.

We support the implementation of small chip components that are essential for miniaturizing substrates, as well as their narrow gap mounting. Our company has contributed to the miniaturization of Sony products by pursuing high-density mounting technology. We provide high-quality support for high-density mounting, such as the implementation of 0402 size components used in mobile devices like smartphones. Additionally, we can also accommodate even smaller 0201 and 03015 size component implementations. 【Features】 ■ Implementation of 0402 size components with narrow gaps ■ Capable of mixed mounting with large components (such as connectors) ■ Also supports the implementation of 0201 and 03015 size components ■ Equipped with solder printing inspection machines, pre-reflow inspection machines, and post-reflow inspection machines to ensure high quality *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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